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1

Grace Reloaded: Caritas in Veritate's Theological Anthropology

Journal:

Theological Studies

Year:

2010

Language:

english

File:

PDF, 493 KB

english, 2010

2

[IEEE 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems (THERMINIC) - Rome, Italy (2008.09.24-2008.09.26)] 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems - Recent progress of thermal interface material research - an overview

Liu, Johan, Michel, Bruno, Rencz, Marta, Tantolin, Christian, Sarno, Claude, Miessner, Ralf, Schuett, Klaus-Volker, Tang, Xinhe, Demoustier, Sebastien, Ziaei, Afshin

Year:

2008

Language:

english

File:

PDF, 613 KB

english, 2008

3

Thermal Measurement and Modeling of Multi-Die Packages

Poppe, A., Yan Zhang,, Wilson, J., Farkas, G., Szabo, P., Parry, J., Rencz, M., Szekely, V.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2009

Language:

english

File:

PDF, 1.99 MB

english, 2009

4

Studies on the heat removal features of stacked SOI structures with a dedicated field solver program (SUNRED)

Zs Kohári, V Székely, M Rencz, A Páhl, V Dudek, B Höfflinger

Journal:

Microelectronics Reliability

Year:

1998

Language:

english

File:

PDF, 1.28 MB

english, 1998

5

A step forward in the transient thermal characterization of chips and packages

V. Szkely, M. Rencz, B. Courtois

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 711 KB

english, 1999

6

THERMAN: a thermal simulation tool for IC chips, microstructures and PW boards

Vladimı́r Székely, András Poppe, Márta Rencz, Miklós Rosental, Tamás Teszéri

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 600 KB

english, 2000

7

CMOS temperature sensors and built-in test circuitry for thermal testing of ICs

V. Székely, M. Rencz, S. Török, Cs. Márta, L. Lipták-Fegó

Journal:

Sensors and Actuators A: Physical

Year:

1998

Language:

english

File:

PDF, 935 KB

english, 1998

8

Book Review: Michel de Certeau: Le Marcheur blesse

Journal:

Theological Studies

Year:

2004

Language:

english

File:

PDF, 33 KB

english, 2004

9

[IEEE 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Paris, France (2015.9.30-2015.10.2)] 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Effect of the trench depth on the linear mode capability of trench technology MOSFET-s

Jamborhazi, Szilard, Czett, Andor, Rencz, Marta

Year:

2015

Language:

english

File:

PDF, 763 KB

english, 2015

10

An efficient reliability testing method combined with thermal performance monitoring

Hantos, G., Hegedüs, J., Rencz, M.

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.83 MB

english, 2017

11

A Scalable Multi-Functional Thermal Test Chip Family: Design and Evaluation

Benedek, Zs., Courtois, B., Farkas, G., Kollár, E., Mir, S., Poppe, A., Rencz, M., Székely, V., Torki, K.

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 1.30 MB

english, 2001

12

Foreword

Rencz, Marta, Lasance, Clemens

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 151 KB

english, 2001

13

Heat-flux sensor to support transient thermal characterisation of IC packages

M. Rencz, E. Kollár, V. Székely

Journal:

Sensors and Actuators A: Physical

Year:

2004

Language:

english

File:

PDF, 347 KB

english, 2004

14

Design for thermal testability (DfTT) and a CMOS realization

V. Székely, Cs. Márta, M. Rencz, Zs. Benedek, B. Courtois

Journal:

Sensors and Actuators A: Physical

Year:

1996

Language:

english

File:

PDF, 418 KB

english, 1996

15

Thermal investigations of ICs and microstructures

B. Courtois, V. Székely, M. Rencz

Journal:

Sensors and Actuators A: Physical

Year:

1998

Language:

english

File:

PDF, 249 KB

english, 1998

16

Transient thermal characterisation of hot plates

Gy. Bognár, P. Fürjes, V. Székely, M. Rencz

Journal:

Microsystem Technologies

Year:

2005

Language:

english

File:

PDF, 394 KB

english, 2005

17

Contactless thermal characterization of high temperature test chamber

György Bognár, Z. Szűcs, V. Székely, M. Rencz

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 353 KB

english, 2009

18

Package hermeticity testing with thermal transient measurements

András Vass-Várnai, Márta Rencz

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 405 KB

english, 2009

19

Biogeochemistry and LANDSAT TM data: Application to gold exploration in northern New Brunswick

A.N. Rencz, G.P. Watson

Journal:

Journal of Geochemical Exploration

Year:

1989

Language:

english

File:

PDF, 679 KB

english, 1989

20

Tracing the thermal behavior of ICs

Szekely, V., Rencz, M., Courtois, B.

Journal:

IEEE Design & Test of Computers

Year:

1998

Language:

english

File:

PDF, 314 KB

english, 1998

21

Thermal monitoring and testing of electronic systems

Szckely, V., Rencz, M., Pahi, A., Courtois, B.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

1999

Language:

english

File:

PDF, 177 KB

english, 1999

22

Alternative technology used to manufacture semitransparent monocrystalline silicon solar cells

Enikő Bándy, Márta Rencz

Journal:

Microsystem Technologies

Year:

2013

Language:

english

File:

PDF, 832 KB

english, 2013

23

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Comparison of JEDEC dynamic and static test methods for the thermal characterization of power LEDs

Vass-Varnai, A., Parry, J., Toth, G., Ress, S., Farkas, G., Poppe, A., Rencz, M.

Year:

2012

Language:

english

File:

PDF, 313 KB

english, 2012

24

A thermal benchmark chip: design and applications

Szekely, V., Marta, C., Rencz, M., Vegh, G., Benedek, Z., Torok, S.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1998

Language:

english

File:

PDF, 474 KB

english, 1998

25

Thermal dynamics and the time constant domain

Szekely, V., Rencz, M.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2000

Language:

english

File:

PDF, 308 KB

english, 2000

26

Image processing procedures for the thermal measurements

Szekely, V., Rencz, M.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

1999

Language:

english

File:

PDF, 1.12 MB

english, 1999

27

Foreword Contributions From Thermal Investigations of ICs and Systems (THERMINIC)

Lasance, C.J.M., Rencz, M.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 271 KB

english, 2005

28

Increasing the accuracy of structure function based thermal material parameter measurements

Rencz, M., Poppe, A., Kollar, E., Ress, S., Szekely, V.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 1.50 MB

english, 2005

29

[IEEE 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) - Budapest, Hungary (2007.09.17-2007.09.19)] 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) - Short time die attach characterization of semiconductor devices

Szabo, Peter, Rencz, Marta

Year:

2007

Language:

english

File:

PDF, 420 KB

english, 2007

30

Measuring partial thermal resistances in a heat-flow path

Rencz, M.R., Szekely, V.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 603 KB

english, 2002

31

Biogeochemical expression of a classic dispersal train of metalliferous till near Hopetown, Ontario

DiLabio, R. N. W., Rencz, A. N., Egginton, P. A.

Journal:

Canadian Journal of Earth Sciences

Year:

1982

Language:

english

File:

PDF, 1.03 MB

english, 1982

32

Calculating effective board thermal parameters from transient measurements

Szekely, V., Rencz, W., Torok, S., Ress, S.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 260 KB

english, 2001

33

Studies on the Nonlinearity Effects in Dynamic Compact Model Generation of Packages

Rencz, M., Szekely, V.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2004

Language:

english

File:

PDF, 343 KB

english, 2004

34

Increasing the accuracy of thermal transient measurements

Szekely, V., Rencz, M.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 491 KB

english, 2002

35

[IEEE 34th Design Automation Conference - Anaheim CA (June 9-13, 1997)] Proceedings of the 34th Design Automation Conference - Cad And Foundries For Microsystems

Karaml, J.M., Courtoisl, B., Boutaminel, H., Drake, P., Poppe, A., Szekely, V., Rencz, M., Hofmann, K., Glesner, M.

Year:

1997

Language:

english

File:

PDF, 1.06 MB

english, 1997

36

Moderate to severe psoriasis patients' subjective future expectations regarding health-related quality of life and longevity

Rencz, F., Holló, P., Kárpáti, S., Péntek, M., Remenyik, É., Szegedi, A., Balogh, O., Herédi, E., Herszényi, K., Jókai, H., Brodszky, V., Gulácsi, L.

Journal:

Journal of the European Academy of Dermatology and Venereology

Year:

2015

Language:

english

File:

PDF, 143 KB

english, 2015

37

Use of Modified Delphi to Plan Knowledge Translation for Decision Makers: An Application in the Field of Advanced Practice Nursing

Carter, N., Lavis, J. N., MacDonald-Rencz, S.

Journal:

Policy Politics & Nursing Practice

Year:

2014

Language:

english

File:

PDF, 424 KB

english, 2014

38

A Methodology for the Co-Simulation of Dynamic Compact Models of Packages With the Detailed Models of Boards

Rencz, MÁrta, Szekely, Vladimir, Poppe, AndrÁs

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2007

Language:

english

File:

PDF, 1.03 MB

english, 2007

39

[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mission profile driven component design for adjusting product lifetime on system level

Szel, Attila, Sarkany, Zoltan, Bein, Marton, Bornoff, Robin, Vass-Varnai, Andras, Rencz, Marta

Year:

2015

Language:

english

File:

PDF, 468 KB

english, 2015

40

The Bizantine Christ. Person, Nature, and Will in the Christology of Saint Maximus the Confessor, (Oxford Early Christian Studies)by Demetrios Bathrellos

Review by: Philipp Gabriel Renczes

Journal:

Year:

2007

Language:

german

File:

PDF, 323 KB

german, 2007

41

Social Utility Values for Pemphigus Vulgaris and Foliaceus: A Composite Time Trade-Off Study

Rencz, F, Gulácsi, L, Tamási, B, Kárpáti, S, Brodszky, V

Journal:

Value in Health

Year:

2015

Language:

english

File:

PDF, 51 KB

english, 2015

42

Measurement Properties of The EQ-5D-5l Compared To The EQ-5D-3L In Psoriasis Patients

Rencz, F, Poór, AK, Péntek, M, Gulacsi, L, Beretzky, Z, Holló, P, Kárpáti, S, Brodszky,

Journal:

Value in Health

Year:

2016

Language:

english

File:

PDF, 106 KB

english, 2016

43

Efficient Implementation of Least Squares Sine Fitting Algorithms

Renczes, Balazs, Kollar, Istvan, Daboczi, Tamas

Journal:

IEEE Transactions on Instrumentation and Measurement

Year:

2016

Language:

english

File:

PDF, 803 KB

english, 2016

44

To the Special section constructed from the selected papers of Thermal investigations of integrated circuits and systems, THERMINIC’15

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 120 KB

english, 2016

45

A Cost-Effectiveness Analysis of Biosimilar Infliximab (Inflectra ®) For The Treatment of Ankylosing Spondylitis In Nine European Countries

Rencz, F, Brodszky,, Péntek, M, Gulacsi, L, Baji, P

Journal:

Value in Health

Year:

2016

Language:

english

File:

PDF, 64 KB

english, 2016

46

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Thermal Characterization and Modeling of Stacked Die Packages

Szabo, P., Rencz, M., Székely, V., Poppe, A., Farkas, G., Courtois, B.

Year:

2005

Language:

english

File:

PDF, 815 KB

english, 2005

47

Is the DLQI appropriate for medical decision-making in psoriasis patients?

Poór, Adrienn Katalin, Brodszky, Valentin, Péntek, Márta, Gulácsi, László, Ruzsa, Gábor, Hidvégi, Bernadett, Holló, Péter, Kárpáti, Sarolta, Sárdy, Miklós, Rencz, Fanni

Journal:

Archives of Dermatological Research

Year:

2017

Language:

english

File:

PDF, 766 KB

english, 2017

48

[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - The influence of the cycling parameters on the reliability test results of IGBTs

Sarkany, Zoltan, Rencz, Marta

Year:

2017

Language:

english

File:

PDF, 254 KB

english, 2017

49

Design of a Static TIM Tester

Székely, V., Kollár, E., Somlay, G., Szabó, P. G., Rencz, M.

Journal:

Journal of Electronic Packaging

Year:

2010

Language:

english

File:

PDF, 1.14 MB

english, 2010

50

Cross-Verification of Thermal Characterization of a Microcooler

Kohári, Zs., Bognár, Gy., Horváth, Gy., Poppe, A., Rencz, M., Székely, V.

Journal:

Journal of Electronic Packaging

Year:

2007

Language:

english

File:

PDF, 579 KB

english, 2007

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